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SOURCE Research and Markets
DUBLIN, July 14, 2014 /PRNewswire/ --Research and Markets has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering.
This report provides an in-depth competitive analysis of key permanent bonding equipment suppliers, with profiles of the main equipment vendors, and their future in the permanent bonding market.
Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV), LED devices, and SOI substrate applications. This type of application is quite complex due to the high diversity of existing bonding technologies.
Permanent bonding is today being applied in:
These have been the 4 main leading applications for permanent bonding for several years. Permanent Bonding processes are increasingly more importance within the Semiconductor industry.
Total permanent bonding market generated almost 5 Million wafers bonded in 8-inch eq, mostly driven by the established applications - BSI CIS and MEMS devices - and is expected to peak at more than 16 Million wafers bonded in 8-inch eq in 2019. The demand for permanent bonding is growing and mainly driven by the miniaturization required for 3D Stack TSV applications.
Objectives of the report are to provide:
Key Topics Covered:
Table of contents
Objectives of the study
Definition, limitations & methodology
2011 vs. 2014 analysis comparison
Companies cited in the report
Introduction, definitions & scope of the report
2013-2019 detailed permanent bonding
Permanent bonding technologies
2013-2019 detailed permanent bonding forecast by applications
Conclusions & perspectives
For more information visit http://www.researchandmarkets.com/research/7xrrwv/permanent_wafer
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